Scavenging

VJE_scavengingScavenging – Non-contact Solder Removal – provides a safe and effective means to prepare rework sites for component replacement.

Automated temperature control and precise scavenging gap prevents risk of damage to pads and solder mask while leaving a consistent layer of residual solder for optimum solderability.

  • Computer controlled process temperature
  • Board conditioning
  • Dynamic Height Control assures consistent scavenger gap regardless of board contour
  • Automated motion provides constant speed for improved uniformity and greater protection from overheating
  • Available on Summit and Micra models